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A low cost individual-well adaptive body bias (IWABB) scheme for leakage power reduction and performance enhancement in the presence of intra-die variations

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2 Author(s)
Chen, T.W. ; Syst. VLSI Technol. Organ., Hewlett Packard Co., Fort Collins, CO, USA ; Gregg, J.

This paper presents a new method of adapting body biasing on a chip during post-fabrication testing in order to mitigate the effects of process variations. Individual well biasing voltages can be changed to be connected either to a chip wide well bias or to a different bias voltage through a self-regulating mechanism, allowing biasing voltage adjustments on a per well basis. The scheme requires only one bias voltage distribution network, but allows for back biasing adjustments to more effectively mitigate die-to-die and within-die process variations. The biasing setting for each well is determined using a modified genetic algorithm. Our experimental results show that binning yields as low as 17% can be improved to greater than 90% after using the proposed IWABB method.

Published in:

Design, Automation and Test in Europe Conference and Exhibition, 2004. Proceedings  (Volume:1 )

Date of Conference:

16-20 Feb. 2004

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