We are currently experiencing intermittent issues impacting performance. We apologize for the inconvenience.
By Topic

Temperature dependence of the electron impact ionization in InGaP-GaAs-InGaP DHBTs

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Neo, Wah-Peng ; Microelectron. Centre, Nanyang Technol. Univ., Singapore ; Hong Wang

Temperature dependence of electron impact ionization in InGaP-GaAs-InGaP double heterojunction bipolar transistors (DHBTs) were comprehensively studied in the temperature range of 300 to 450 K. It has been found that, as the temperature increases, the electron multiplication in the InGaP collector is found to be weakly reduced, which results in a relatively small negative temperature dependence of junction breakdown. The temperature dependence of electron impact ionization at elevated temperatures for InGaP material is investigated based on the electron multiplications measured from the InGaP collector region. An empirical expression is obtained to predict the electron ionization coefficients at elevated temperature up to 450 K in the electric field range of 380 to 650 kV/cm. As compared to InP and GaP binaries, the ternary InGaP shows a lower electron ionization coefficient and much weaker temperature dependence. We found that, introducing additional scattering mechanism such as alloy scattering would provide a better interpretation on the low electron impact ionization and its weak temperature dependence observed in InGaP.

Published in:

Electron Devices, IEEE Transactions on  (Volume:51 ,  Issue: 3 )