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We present a new multisectional model for high-speed electrooptic modulators, fully integrated within the framework of a microwave circuit computer-aided design (CAD) suite (MWOFFICE). Starting from geometrical and layout parameters, the model allows both simple (traveling-wave) and complex (phase reversal, periodically loaded) structures to be assembled, analyzed, and optimized from the standpoint of the electrical and electrooptic response (including chirp effects) both in small-signal (analog) and in large-signal (digital) operation, exploiting standard simulator tools. At no additional effort, parasitic and passive elements (such as optical or electrical delay paths) can be directly included in the modulator schematic, and the effect of transitions and package parasitics can be readily accounted for at a circuit level. Moreover, model integration within a circuit CAD suite enables one to seamlessly perform driver and modulator design and optimization within the same monolithic or hybrid circuit environment. Comparisons with experimental and literature data and design examples are presented to validate the approach and stress its potential in the design of high-speed electrooptic modulators.