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Application of cluster tool modeling to a 300 mm fab simulation

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3 Author(s)
S. T. Shikalgar ; IBM Microelectron. Div., East Fishkill, NY, USA ; D. Fronckowiak ; E. A. MacNair

300 mm semiconductor wafer fabrication facilities, like conventional semiconductor fabs, contain many different types of tools. We discuss a realistic way of representing cluster tools in a simulation model of the entire line. A more realistic representation of cluster tools results in greater accuracy in the output of the simulation model.

Published in:

Simulation Conference, 2003. Proceedings of the 2003 Winter  (Volume:2 )

Date of Conference:

7-10 Dec. 2003