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A novel silicon-on-glass integrated bipolar technology is presented. The transfer to glass is performed by gluing and subsequent removal of the bulk silicon to a buried oxide layer. Low-ohmic collector contacts are processed on the back-wafer by implantation and dopant activation by excimer laser annealing. The improved electrical isolation with reduced collector-base capacitance, collector resistance and substrate capacitance, also provide an extremely good thermal isolation. The devices are electrothermally characterized in relationship to different heat-spreader designs by electrical measurement and nematic liquid crystal imaging. Accurate values of the temperature at thermal breakdown and thermal resistance are extracted from current-controlled Gummel plot measurements.
Date of Publication: Jan. 2004