By Topic

Power delivery and locomotion of untethered microactuators

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
B. R. Donald ; Comput. Sci. Dept., Dartmouth Coll., Hanover, NH, USA ; C. G. Levey ; C. D. McGray ; D. Rus
more authors

The ability for a device to locomote freely on a surface requires the ability to deliver power in a way that does not restrain the device's motion. This paper presents a MEMS actuator that operates free of any physically restraining tethers. We show how a capacitive coupling can be used to deliver power to untethered MEMS devices, independently of the position and orientation of those devices. Then, we provide a simple mechanical release process for detaching these MEMS devices from the fabrication substrate once chemical processing is complete. To produce these untethered microactuators in a batch-compatible manner while leveraging existing MEMS infrastructure, we have devised a novel postprocessing sequence for a standard MEMS multiproject wafer process. Through the use of this sequence, we show how to add, post hoc , a layer of dielectric between two previously deposited polysilicon films. We have demonstrated the effectiveness of these techniques through the successful fabrication and operation of untethered scratch drive actuators. Locomotion of these actuators is controlled by frequency modulation, and the devices achieve maximum speeds of over 1.5 mm/s.

Published in:

Journal of Microelectromechanical Systems  (Volume:12 ,  Issue: 6 )