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A high performance SiGe HBT has been integrated in a 0.25 /spl mu/m BiCMOS technology optimised for low power applications. A deep trench module is implemented, offering a reduction of the perimeter collector-substrate capacitance by a factor of 5 while at the same time maintaining the wafer surface topography. The in-situ boron doped SiGe profile has been optimised towards a reduction of the base-emitter capacitance. High-quality, low-cost passive components like varactors, high-Q post-processed inductors and highly linear nondispersive MIM capacitors are offered, broadening the low power capabilities of this technology.