Referenced Items are not available for this document.
This work investigates the influence of post mould cure (PMC) duration on the viscoelastic properties of a low stress, epoxy mould compound. Results show glass transition increases while modulus measured at room temperature decreases with increasing PMC duration. Glass transition typically increases with increasing PMC as cross-linking density increases. Modulus is not expected to decrease with increased cross-link density. It is postulated that progressive attachment of silicone particles to the cross-link network of the encapsulant is active during PMC. The net effect of the attachment of silicone particles to the cross-linked network and increased cross-link density as a result of residual cure is a decrease in modulus with increasing post mould cure.
Published in:
Electronics Packaging Manufacturing, IEEE Transactions on
(Volume:26
,
Issue:
3
)
Date of Publication: July 2003
- Page(s):
- 211 - 215
- ISSN :
- 1521-334X
- INSPEC Accession Number:
- 7827622
- Digital Object Identifier :
- 10.1109/TEPM.2003.820803
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 07 January 2004
- Issue Date :
- July 2003
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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