By Topic

An optimization study of underfill dispensing volume

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
YewChoon Chia ; Electron. Assembly Div., Seagate Technol. Inc., Singapore ; HongSee Yam ; S. H. Lim ; K. S. Chian
more authors

The underfill dispensing volume has been modeled and verified through both experiments and application of statistical technique. The model established is capable of estimating the operating range of the dispensing volume of a defined flip chip assembly and is targeted to reduce wastage as well whilst fulfilling the reliability requirement. The model has taken into consideration the reliability factor, e.g., presence of fillet; manufacturing tolerance of bumps size and standoff variation. In this study, the actual volume for flip chip assemblies prepared in a controlled manner, so that fillets were seen on all sides, was compared with the recommended underfill volume. It was found that the model tended to yield a higher volume and it is concluded that this variation is related to the over estimation of the fillet element in the formulation. For reliability assessment, these flip chip assemblies were examined under C-mode SAM and no voids were found. These flip chip assemblies also passed electrical testing after 500 cycles of air to air thermal cycles and therefore are proven to meet the reliability requirement.

Published in:

IEEE Transactions on Electronics Packaging Manufacturing  (Volume:26 ,  Issue: 3 )