By Topic

High-speed bit-error-rate measurement system for high-temperature superconducting digital circuits

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Horibe, M. ; Supercond. Res. Lab., Int. Supercond. Technol. Center, Tokyo, Japan ; Tarutani, Y. ; Tanabe, K.

We have investigated and tried to improve the packaging technologies for a bit-error-rate (BER) measurement system for high-Tc superconducting circuits. Signal cables, test fixture, and magnetic shields were specially designed and assembled for the BER measurement system, taking into account electrical losses, signal reflection, heat inflow, and power consumption of a cryocooler. BER was further improved by changing the way of connection between the semiconductor amplifiers outside the sample vacuum chamber. These improvements led to a BER less than 10-12 at an output voltage (Vout) of 1.7 and 2.3 mV for a 50-Ω standard microstrip transmission line and a superconducting microstrip-line to coplanar-waveguide transmission-line converter, respectively. The temperature rise of the test fixture was as low as about 2 K. These values are approximately one order of magnitude smaller than those in the previous measurement system and small enough to be achieved by using superconducting interface circuits. Furthermore, 1-Gb/s operation of a superconducting quantum interference device array-type interface circuit was demonstrated in the BER measurement system at 40 K.

Published in:

Applied Superconductivity, IEEE Transactions on  (Volume:13 ,  Issue: 4 )