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Compensation of packaging asymmetry in a 2-D wind sensor

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3 Author(s)
Matova, S.P. ; Fac. of Inf. Technol. & Syst., Delft Univ. of Technol., Netherlands ; Makinwa, K.A.A. ; Huijsing, J.H.

The influence of packaging on the behavior of a two-dimensional thermal wind sensor has been investigated. Non-ideal packaging increases the thermal asymmetry in the sensor, which in turn distorts its output signal. Such distortion can be compensated for by adjusting the heat distribution in the sensor. Using a combination of CAD modeling techniques, expressions have been derived from which the compensating heat distribution may be directly computed from the uncompensated sensor output.

Published in:

Sensors Journal, IEEE  (Volume:3 ,  Issue: 6 )

Date of Publication:

Dec. 2003

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