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The most important contribution in the title paper by F.Y. Young et al. [ibid., vol. 20, pp. 687-692, 2001] is that they devised an efficient method to compute the shapes of soft modules to give the optimal packing, as described by the authors. We would like to clarify a misunderstanding that occurred when the authors referred to our paper [IEEE Trans. Circuits Syst. I, vol. 43, pp. 713-720, 1996].