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Comments on "Handling soft modules in general nonslicing floorplan using Lagrangian relaxation"

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2 Author(s)
Teng-Sheng Moh ; Quicktran Corp., Cupertino, CA, USA ; Chang, Tsu-Shuan

The most important contribution in the title paper by F.Y. Young et al. [ibid., vol. 20, pp. 687-692, 2001] is that they devised an efficient method to compute the shapes of soft modules to give the optimal packing, as described by the authors. We would like to clarify a misunderstanding that occurred when the authors referred to our paper [IEEE Trans. Circuits Syst. I, vol. 43, pp. 713-720, 1996].

Published in:

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:22 ,  Issue: 12 )

Date of Publication:

Dec. 2003

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