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In this work, 8×8 and 4×8 arrays of 850 nm oxide-confined VCSELs with 250 μm device pitch are directly hybridized onto silicon fanout chips by means of an indium solder based flip-chip technology. Using this structure, digital data transmission experiments are conducted, which demonstrates that quasi error-free (bit error rate <10-12) 10 Gbit/s transmission can be achieved.
Lasers and Electro-Optics Society, 2003. LEOS 2003. The 16th Annual Meeting of the IEEE (Volume:2 )
Date of Conference: 27-28 Oct. 2003