Referenced Items are not available for this document.
In this work, 8×8 and 4×8 arrays of 850 nm oxide-confined VCSELs with 250 μm device pitch are directly hybridized onto silicon fanout chips by means of an indium solder based flip-chip technology. Using this structure, digital data transmission experiments are conducted, which demonstrates that quasi error-free (bit error rate <10-12) 10 Gbit/s transmission can be achieved.
Published in:
Lasers and Electro-Optics Society, 2003. LEOS 2003. The 16th Annual Meeting of the IEEE
(Volume:2
)
Date of Conference: 27-28 Oct. 2003
- Page(s):
- 511 - 512 vol.2
- ISSN :
- 1092-8081
- Print ISBN:
- 0-7803-7888-1
- INSPEC Accession Number:
- 8081157
- Digital Object Identifier :
- 10.1109/LEOS.2003.1252898
- Product Type:
- Conference Publications
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