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Low thermal resistance flip-chip bonding of 850 nm 2-D VCSEL arrays capable of 10 Gbit/s/ch operation

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2 Author(s)
H. Roscher ; Optoelectron. Dept., Ulm Univ., Germany ; R. Michalzik

In this work, 8×8 and 4×8 arrays of 850 nm oxide-confined VCSELs with 250 μm device pitch are directly hybridized onto silicon fanout chips by means of an indium solder based flip-chip technology. Using this structure, digital data transmission experiments are conducted, which demonstrates that quasi error-free (bit error rate <10-12) 10 Gbit/s transmission can be achieved.

Published in:

Lasers and Electro-Optics Society, 2003. LEOS 2003. The 16th Annual Meeting of the IEEE  (Volume:2 )

Date of Conference:

27-28 Oct. 2003