Low thermal resistance flip-chip bonding of 850 nm 2-D VCSEL arrays capable of 10 Gbit/s/ch operation

In this work, 8/spl times/8 and 4/spl times/8 arrays of 850 nm oxide-confined VCSELs with 250 /spl mu/m device pitch are directly hybridized onto silicon fanout chips by means of an indium solder based flip-chip technology. Using this structure, digital data transmission experiments are conducted, which demonstrates that quasi error-free (bit error rate <10/sup -12/) 10 Gbit/s transmission can be achieved.