Referenced Items are not available for this document.
We have shown the variation of the RF performance of the QFN package in accordance with its high volume manufacturing and assembly process. We have also developed a distributed model for the chip-to-package interconnect.
Published in:
Electrical Performance of Electronic Packaging, 2003
Date of Conference: 27-29 Oct. 2003
- Page(s):
- 79 - 82
- Print ISBN:
- 0-7803-8128-9
- INSPEC Accession Number:
- 7892436
- Conference Location :
- Princeton, NJ, USA
- Digital Object Identifier :
- 10.1109/EPEP.2003.1250004
- Product Type:
- Conference Publications
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