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Statistical analysis and modelling of low-cost leadless packages for wireless applications based on non-destructive measurements

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2 Author(s)
U. Pfeiffer ; IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA ; A. Chandrasekhar

We have shown the variation of the RF performance of the QFN package in accordance with its high volume manufacturing and assembly process. We have also developed a distributed model for the chip-to-package interconnect.

Published in:

Electrical Performance of Electronic Packaging, 2003

Date of Conference:

27-29 Oct. 2003