Referenced Items are not available for this document.
High Q copper inductors were fabricated on low-cost and low-loss BT and glass substrates using an electroplating process. A differential LC VCO circuit was designed using these high Q inductors at 2.4 GHz. Flip chip and MCM technology were applied to assemble the active chips on BT and glass substrates. The inductors exhibited a Q-factor as high as 30 at 2.4 GHz. VCOs with copper inductors on BT and glass substrates had a phase noise of -108 dBc/Hz at 600 kHz offset for a 2.4 GHz carrier, which is a 6 dB improvement compared with the one with on-chip Al inductors.
Published in:
Custom Integrated Circuits Conference, 2003. Proceedings of the IEEE 2003
Date of Conference: 21-24 Sept. 2003
- Page(s):
- 537 - 540
- Print ISBN:
- 0-7803-7842-3
- INSPEC Accession Number:
- 7838915
- Digital Object Identifier :
- 10.1109/CICC.2003.1249455
- Product Type:
- Conference Publications
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