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Advances in RF packaging technologies for next-generation wireless communications applications [RFIC]

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2 Author(s)
Larson, L. ; Univ. of California, USA ; Jessie, D.

The performance of a radio frequency integrated circuit can be dramatically affected by the package environment, yet packaging technology has received comparatively little attention compared to IC fabrication technology or RFIC design. This paper summarizes the key developments and trends in RFIC packaging, with particular attention to improvements in plastic package design, low-temperature co-fired ceramic (LTCC) flip-chip approaches, and system-in-package (SIP) implementations.

Published in:

Custom Integrated Circuits Conference, 2003. Proceedings of the IEEE 2003

Date of Conference:

21-24 Sept. 2003