Scheduled System Maintenance:
Some services will be unavailable Sunday, March 29th through Monday, March 30th. We apologize for the inconvenience.
By Topic

Evanescent microwave microscopy of thermally-damaged charge coupled devices

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Kleismit, R.A. ; Wright State Univ., Dayton, OH, USA ; Kazimierczuk, M.K.

Evanescent Microwave Probe (EMP) scanning is used to detect thermal damage in silicon (Charge Coupled Device) CCD arrays. The CCD is a solid-state chip that turns light into electric signals and essentially functions as a camera-on-a-chip. These devices have been used on flight missions such as the Galileo mission to Jupiter and the Hubble space telescope. The primary interest is in the amount of damage these devices can withstand and remain functional. Evanescent microwave probes have the unique ability to image subsurface features under semi-conducting or dielectric materials. This nondestructive evaluation technique will allow fast and highly accurate surface/subsurface scans of damaged CCD array devices.

Published in:

Electrical Insulation Conference and Electrical Manufacturing & Coil Winding Technology Conference, 2003. Proceedings

Date of Conference:

23-25 Sept. 2003