PFC's (Perfluorocompounds) are widely used for CVD chambers clean, and have been associated with damage to the environment-atmosphere due to their infrared absorbance and long decomposition time. PFC's impact to the environment is considered so significant, that Intel Corp. has decided to replace current cleaning procedures using PFCs (C2F6). This paper describes the research and development of a new clean procedure for a CVD process tool by using FMAT (C4F8O) gas, which allows dramatic reduction in PFC emission (∼90%).
Published in:
Semiconductor Manufacturing, 2003 IEEE International Symposium on
Date of Conference: 30 Sept.-2 Oct. 2003