Referenced Items are not available for this document.
This paper presents the application of advanced process control (APC) to tighten the distribution of LPCVD deposited polysilicon thickness during device manufacturing on 300mm wafers. Using APC, a 40% reduction in thickness variation is achieved. This improvement is possible by 1) automatically feeding back deposition time adjustments, 2) introduction of load size based compensation and 3) optimizing the response factor in the feed back loop.
Published in:
Semiconductor Manufacturing, 2003 IEEE International Symposium on
Date of Conference: 30 Sept.-2 Oct. 2003
- Page(s):
- 119 - 122
- ISSN :
- 1523-553X
- Print ISBN:
- 0-7803-7894-6
- INSPEC Accession Number:
- 7953324
- Digital Object Identifier :
- 10.1109/ISSM.2003.1243245
- Product Type:
- Conference Publications
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