By Topic

5X capability improvement for 0.13 μm new product introductions

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Auchard, D. ; Intel Corp., Santa Clara, CA, USA ; Hoppe, M.K. ; Keith, C.

This paper describes the key strategies and systems that enabled a leading edge wafer fab to increase its 0.13 μm new product introduction (NPI) capability by 5x in less than 18 months without additional capital or headcount. For purposes of this paper, the NPI capability of the fab is defined as the rate at which the fab can deliver new product lots, or NPI's. The specific strategies for delivering the increase involved simultaneously reducing the engineering content associated with an NPI and decreasing the throughput time (TPT) of NPI lots to world-class levels.

Published in:

Semiconductor Manufacturing, 2003 IEEE International Symposium on

Date of Conference:

30 Sept.-2 Oct. 2003