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We describe the packaging and testing of a two-dimensional array parallel-optics module with 36 channels with each channel operating up to 3.3 Gb/s. This represents the first commercial module based on direct integration of vertical-cavity surface-emitting lasers (VCSELs) onto silicon very large scale integration (VLSI) circuits using a hybrid optoelectronic-VLSI technology. The module eliminates wire bonds between the driver/receiver chips and the corresponding VCSELs thereby reducing crosstalk and power dissipation, simplifying packaging and alignment, and simultaneously improving bandwidth and total link jitter performance.
Selected Topics in Quantum Electronics, IEEE Journal of (Volume:9 , Issue: 2 )
Date of Publication: March-April 2003