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Browse Journals & Magazines > Advanced Packaging, IEEE Tran ...> Volume:26 Issue:3 Help

Laser-assisted sealing and testing for ceramic packaging of MEMS devices

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5 Author(s)
Yi Tao ; High Density Electron. Center (HiDEC), Univ. of Arkansas, Fayetteville, AR, USA ; Malshe, A.P. ; Brown, W.D. ; Dereus, D.R.
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In this work, a CO2 laser-assisted silicon lid sealing process, utilizing Au80/Sn20 solder, for encapsulating gas breakdown test micro-electro-mechanical structures (MEMS) in a ceramic quad flatpack (CQFP) was studied. Wire bonded MEMS dies were sealed into CQFPs under various gas media, such as air, nitrogen, helium and vacuum. The gas breakdown test results showed a significantly higher breakdown voltage for vacuum packaged parts compared to those packaged in other various gas environments. Hermeticity testing according to MIL-STD-883E showed that the leak rate of the package was below 10-8 atm cc/s. The bonding was uniform and the bonding strength is believed to be comparable to the tensile strength of Au80/Sn20 solder.

Published in:
Advanced Packaging, IEEE Transactions on  (Volume:26 ,  Issue: 3 )

Date of Publication: Aug. 2003

Page(s):
283 - 288
ISSN :
1521-3323
INSPEC Accession Number:
7765604
Digital Object Identifier :
10.1109/TADVP.2003.817969
Date of Current Version :
14 October 2003
Issue Date :
Aug. 2003
Sponsored by :
IEEE Components, Packaging, and Manufacturing Technology Society

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