Cart (Loading....) | Create Account
Close category search window

Determining the impact resistance of electrically conductive adhesives using a falling wedge test

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Shuangyan Xu ; Dept. of Eng. Sci. & Mech., State Univ., Blacksburg, USA ; Dillard, D.A.

This study was conducted to determine the impact resistance of electrically conductive adhesives (ECAs). A novel falling wedge test that was used to quantitatively characterize the impact resistance of conductive adhesives at a material level has been described, and some important findings obtained from the falling wedge test are presented. This unique impact resistance testing method is not only a substitution of the conventional drop test which has several severe drawbacks, but also provides some useful information for screening adhesives at the materials level and helping formulate new conductive adhesives with improved impact performance. Three model conductive adhesives were studied in this work and the impact fracture energies of the adhesive materials were measured utilizing the falling wedge test. The effect of test temperature on the fracture behavior of ECAs was examined and the correlation between the impact resistance and damping property of the conductive adhesive was also investigated. This study suggests that 1) the falling wedge test is able to discriminate between adhesives and this technique is capable of screening adhesives for bonding purposes; 2) the viscoelastic energy has played an important role in the fracture behavior of the conductive adhesives. As a measure of the internal friction, the loss factor tanδ is found to be a good indicator of a conductive adhesive's ability to withstand impact loading.

Published in:

Components and Packaging Technologies, IEEE Transactions on  (Volume:26 ,  Issue: 3 )

Date of Publication:

Sept. 2003

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.