Cart (Loading....) | Create Account
Close category search window
 

Texture analysis based on local semicovers

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Cuenca, S.A. ; Dept. de Tecnologia Informatica y Computacion, Alicante Univ., Spain

The paper presents a new efficient approach to texture analysis based on distributions of simple spatial and tonal relationships. The texture description proposed makes use of a semicover concept over binary planes derived from grey images. A measure of the local semicover tendency based on joint occurrences of elementary semicover patterns is described, and a computation simplification method is presented to reduce the computational cost. The method presents a reduced set of parameters that facilitates its optimization in different types of application. The performance of the method is evaluated by means of a comparative study, including other algorithms widely used in texture analysis. The results show a similar or superior performance to other more complex approaches.

Published in:

Image Analysis and Processing, 2003.Proceedings. 12th International Conference on

Date of Conference:

17-19 Sept. 2003

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.