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IC wire bond inspection using elliptical model approximation

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2 Author(s)
Ngan, K.N. ; Dept. of Electr. Eng., Nat. Univ. of Singapore, Singapore ; Kang, S.B.

An algorithm that has been developed to inspect the integrity of wire bonds on an IC die is described. The algorithm uses of an elliptical model to approximate the shape of the bond so that any aberrations from the specified dimensions can be easily identified. Missing bonds and double bonds can also be detected

Published in:

Robotics and Automation, 1988. Proceedings., 1988 IEEE International Conference on

Date of Conference:

24-29 Apr 1988