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The aim of this work is to show the effective way for the formation of optical MEMS switches by applying seamless integration technology (SeaiT) as a first step toward LSI integration. The fabrication process of the optical MEMS switches in this work consisted of electrode fabrication, mirror fabrication, and packaging. A 6-inch-diameter bulk-Si and SOI wafers are used for the fabrication of electrodes and mirrors, respectively.
Optical MEMS, 2003 IEEE/LEOS International Conference on
Date of Conference: 18-21 Aug. 2003