Referenced Items are not available for this document.
The aim of this work is to show the effective way for the formation of optical MEMS switches by applying seamless integration technology (SeaiT) as a first step toward LSI integration. The fabrication process of the optical MEMS switches in this work consisted of electrode fabrication, mirror fabrication, and packaging. A 6-inch-diameter bulk-Si and SOI wafers are used for the fabrication of electrodes and mirrors, respectively.
Published in:
Optical MEMS, 2003 IEEE/LEOS International Conference on
Date of Conference: 18-21 Aug. 2003
- Page(s):
- 121 - 122
- Print ISBN:
- 0-7803-7830-X
- INSPEC Accession Number:
- 7977989
- Digital Object Identifier :
- 10.1109/OMEMS.2003.1233496
- Product Type:
- Conference Publications
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