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3D MEMS antenna for IR sensor using novel UV-lithography, plastic micromachining and mesh structure bonding technique

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4 Author(s)
Jong-Yeon Park ; Microsystem Res. Center, Korea Inst. of Sci. & Technol., Seoul, South Korea ; Kun-Tae Kim ; Sung Moon ; Pak, J.J.

This paper describes the novel UV-lithography technique for fabrication of 3D feed horn mold structure array using implementation of mirror reflected parallel beam illuminator (MRPBI) system, fabrication of 3D feed horn MEMS antenna's plate using plastic micromachining (PMM) by polydimethylsiloxane (PDMS) and the 3D MEMS antenna array are assembled using novel 3D MEMS bonding technique by mesh structure bonding (MSB) method.

Published in:

Optical MEMS, 2003 IEEE/LEOS International Conference on

Date of Conference:

18-21 Aug. 2003