Referenced Items are not available for this document.
One of the key components for the WDM optical communication is a wavelength tunable filter. The packaging technology of the tunable filter with Fabry-Perot cavity based on optical MEMS is investigated for the low power consumption and mass production. The flip chip process with Au-20(wt.%)Sn solder was conducted to integrate two DBR mirrors in parallel with a constant distance for the simple design of packaging structure. TEC fiber was used to achieve a wide range of the optical alignment tolerance for the high coupling efficiency.
Published in:
Optical MEMS, 2003 IEEE/LEOS International Conference on
Date of Conference: 18-21 Aug. 2003
- Page(s):
- 67 - 68
- Print ISBN:
- 0-7803-7830-X
- INSPEC Accession Number:
- 7977969
- Digital Object Identifier :
- 10.1109/OMEMS.2003.1233470
- Product Type:
- Conference Publications
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