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Integrating the SOI and poly-Si surface structures in a monolithic process for optical devices platform

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3 Author(s)
Mingching Wu ; Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan ; Shiunafang Shy ; Weileun Fang

This work has successfully integrated thick single-crystal silicon (SCS) and thin film poly-Si microstructures on a SOI wafer using monolithic processes. Thus high optical quality micromirror and large output microactuators are available using the thick SOl wafer. Moreover, the poly-Si thin film microstructures serve as micro-hinges and stress-induced self-assembly mechanisms. The microstructures will be lifted and assembled by SixNy/poly-Si bimorph beams after releasing. This integrated process can substantially increase the feasibility of fabricating MEMS devices using SCS.

Published in:

Optical MEMS, 2003 IEEE/LEOS International Conference on

Date of Conference:

18-21 Aug. 2003