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Integration of the fabrication processes and wafer level packaging of MEMS devices using localized induction heating

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3 Author(s)
Hsuehan Yang ; Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan ; Mingching Wu ; Weileun Fang

This paper reports a new method for the integration of fabrication processes and wafer level packaging of optical MEMS device. The electroplated magnetic thick film was employed to realize the localized heating assisted wafer level package. Due to the solder reflow and electroplating technique, hermetic seal of the packaged device is achieved. In addition, the electroplated thick film also performed as a spacer. In applications, the integration the MUMPs devices with the proposed packaging techniques were demonstrated.

Published in:

Optical MEMS, 2003 IEEE/LEOS International Conference on

Date of Conference:

18-21 Aug. 2003