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Wafer-package test mix for optimal defect detection and test time savings

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1 Author(s)

For years, it has been common to run a test at wafer and then exactly the same test again at package. This article shows how one company took a detailed look at the wafer/package test mix and adjusted it to reduce cost while retaining quality.

Published in:

Design & Test of Computers, IEEE  (Volume:20 ,  Issue: 5 )