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Leakage power is emerging as a key design challenge in current and future CMOS designs. Since leakage is critically dependent on operating temperature and power supply, we present a full chip leakage estimation technique which accurately accounts for power supply and temperature variations. State of the art techniques are used to compute the thermal and power supply profile of the entire chip. Closed-form models are presented which relate leakage to temperature and VDD variations. These models coupled with the thermal and VDD profile are used to generate an accurate full chip leakage estimation technique considering environmental variations. The results of this approach are demonstrated on large-scale industrial designs.