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Summary form only given, as follows. Parylene-c (Pa-c) film is a pinhole-free barrier against moisture, chemical and biofluid. So it is candidate for low dielectric materials for the application of biosensors such as DNA and protein chip Pa-c and SiO/sub 2/ films are deposited on a Si substrate using a vapor deposition method and LPCVD, respectively. Au was then deposited on both substrates using the e-beam evaporation method. For improvement of Au adhesion on Pa-c and SiO/sub 2/ surfaces, surface modification of Pa-c and SiO/sub 2/ was performed using oxygen plasma. Pa-c and SiO/sub 2/ layers were exposed to an oxygen plasma using a reactive ion etcher at various power and times.