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Improvement of Au adhesion on parylene-c and SiO/sub 2/ substrates using oxygen plasma treatment

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5 Author(s)
Lee, J.H. ; Mcrosystem Res. Center, KIST, Seoul, South Korea ; Hwang, K.S. ; Yoon, K.H. ; Kim, T.S.
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Summary form only given, as follows. Parylene-c (Pa-c) film is a pinhole-free barrier against moisture, chemical and biofluid. So it is candidate for low dielectric materials for the application of biosensors such as DNA and protein chip Pa-c and SiO/sub 2/ films are deposited on a Si substrate using a vapor deposition method and LPCVD, respectively. Au was then deposited on both substrates using the e-beam evaporation method. For improvement of Au adhesion on Pa-c and SiO/sub 2/ surfaces, surface modification of Pa-c and SiO/sub 2/ was performed using oxygen plasma. Pa-c and SiO/sub 2/ layers were exposed to an oxygen plasma using a reactive ion etcher at various power and times.

Published in:

Plasma Science, 2003. ICOPS 2003. IEEE Conference Record - Abstracts. The 30th International Conference on

Date of Conference:

5-5 June 2003