Cart (Loading....) | Create Account
Close category search window
 

Manufacturing issues for 3D integrated active circuits into organic laminate substrates

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)

The three dimensional integration of active circuits, thinned or in standard thickness, into polymeric substrates challenges current substrate manufacturing processes in an unprecedented way. In order to overcome the risks associated with this 3D integration technology, the issues must be carefully studied and assessed. For the direct integration of ultrathin chips into dielectric build up layers of multi-layer printed circuit boards, such issues were identified and put to the test using advanced pcb manufacturing methods. Among the risks encountered in a manufacturing ambient Material selection (i)linear tolerance on a 18×12" board (ii)placement of ultrathin dice (iii)lamination process (iv)laser/plasma via formation (v)electroless deposition of seed layer (vi)patterning of the contact structures (vii)testing voltages were observed to be the ones affecting the outcome and will be discussed.

Published in:

Electronics Manufacturing Technology Symposium, 2003. IEMT 2003. IEEE/CPMT/SEMI 28th International

Date of Conference:

16-18 July 2003

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.