Cart (Loading....) | Create Account
Close category search window
 

A novel clustering and declustering algorithm for fuzzy classification of wafer defects

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
El Doker, T.A. ; Dept. of Electr. Eng., Northern Arizona Univ., Flagstaff, AZ, USA ; Scott, D.R.

A method has been developed for enhancing the efficiency and accuracy of wafer defect analysis for yield improvement. This multi-step fuzzy algorithm has been developed for automatic clustering and classification of wafer defects. The algorithm utilizes a combination of new and existing feature measurements to identify and match defects with those referenced in a defect classes library. The process is more efficient than other approaches like pair-wise K-Nearest Neighbor (K-NN) classifiers and other fuzzy methods, which can be computationally very expensive. The algorithm also offers improved accuracy and the ability to decluster defects in cases where more than one overlap.

Published in:

University/Government/Industry Microelectronics Symposium, 2003. Proceedings of the 15th Biennial

Date of Conference:

30 June-2 July 2003

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.