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Wideband characterization and modeling of TAB packages using time domain techniques

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5 Author(s)
Su, W. ; Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA ; Riad, S.M. ; Poulin, T. ; Fett, D.
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A method for wideband characterization and modeling of tape automated bonding (TAB) packages using time-domain techniques is described. The method uses time-domain reflectometry data along with the modified transient circuit analysis package (MTCAP) to develop a physically based equivalent circuit model. The model accurately simulates the TAB over a wide band of frequencies (DC to >25 GHz). Computer simulations based on the model were performed to predict TAB performance parameters. Results of both the experimental measurements and computer simulations are presented

Published in:

Electronic Components and Technology Conference, 1990. ., 40th

Date of Conference:

20-23 May 1990