By Topic

Reliability and failure analysis of SnAgCu solder interconnections on NiAu surface finish

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Ratchev, P. ; IMEC, Leuven, Belgium ; Vandevelde, B. ; De Wolf, I.

The authors study the reliability and failure mechanisms of eutectic SnAgCu solder interconnects on NiAu surface finish. As a comparision, the reliability and failure mechanism of standard SnPb solder joints on SiAu surface finish is studied as well. The similarities and differences in the failure modes for both solders are analysed and discussed.

Published in:

Physical and Failure Analysis of Integrated Circuits, 2003. IPFA 2003. Proceedings of the 10th International Symposium on the

Date of Conference:

7-11 July 2003