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Analysis and simulation of multiconductor transmission lines for high-speed interconnect and package design

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2 Author(s)
Hong You ; Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA ; Soma, M.

The authors present a novel approach to the crosstalk analysis of high-speed interconnects which are modeled as multiconductor transmission lines. The method is applicable to the general problem of N coupled lossy and/or dispersive interconnects with arbitrary linear source/load impedances. Closed-form formulas for determining the voltage and current transfer functions are derived using the spectral domain modal analysis technique. The transfer function is expanded to its Taylor series form, and the inverse Fourier transform is applied to the significant terms in the series. As a result, analytical expressions of time-domain signal waveforms are obtained. Besides providing valuable insight into the coupling phenomenon, the formulas facilitate analytical computation of noise and waveform distortion due to crosstalk

Published in:

Electronic Components and Technology Conference, 1990. ., 40th

Date of Conference:

20-23 May 1990

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