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Tapes and thick films for high frequency packaging

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3 Author(s)
R. L. Wahlers ; Electro-Sci. Lab. Inc., King of Prussia, PA, USA ; S. J. Stein ; G. P. Sykora

Low-K dielectrics in both thick-film and tape formats have been developed for meeting advanced packaging requirements. Compositions were formulated which fired to dense films at 850°C and provided a thermal coefficient of expansion (TCE) match to 96% Al2O3. Dielectric constants ranged from 4.0 to 5.0, depending on the termination and firing conditions. These dense low-dielectric-constant materials were characterized with respect to temperature dependence of K, dissipation factor, insulation resistance, and breakdown voltage. Moisture resistance, as determined by pressure-cooker testing, was also measured. Frequency effects in the range of 1 kHz to 1 MHz were determined with some measurements taken at frequencies as high as 9.3 GHz. Partial densification, binder decomposition, and controlled gas generation techniques were investigated as a means to introduce porosity and thereby lower K values. The most successful technique, controlled gas generation, produced pore porosity and K values as low as 2.5

Published in:

Electronic Components and Technology Conference, 1990. ., 40th

Date of Conference:

20-23 May 1990