Compact physical IR-drop models for GSI power distribution networks

The supply voltage decrease and power density increase of future GSI chips demands accurate models for the IR-drop voltage. Compact physical IR-drop models are derived for two types of packages. These models help designers estimate the required amount of interconnects and package pins which need to be dedicated for power distribution. Comparison with SPICE simulations show less than 1% and 5% error for the wire-bond package and the area-array package, respectively.