Cart (Loading....) | Create Account
Close category search window

Thermokinetic actuation for batch assembly of microscale hinged structures

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)

This paper reports on surface micromachined hinged structure assembly using thermokinetic forces in the molecular flow regime. Ultrasonic vibration energy is used to reduce the static friction making the thermokinetic force comparatively significant. The thermokinetic force, resulting from the more energetic gas molecules emanating from the heated substrate, increases with pressure and substrate temperature in the molecular flow regime. The transition from viscous to molecular regime occurs as the molecular mean-free-path approximately equals the flap length, making the pressure threshold for thermokinetic flap actuation size dependent. In addition to the experimental results, one-dimensional (1-D) and two-dimensional (2-D) force models are presented. Examples of assembled structures are shown and assembly jig suitable for automated MEMS batch assembly is demonstrated.

Published in:

Microelectromechanical Systems, Journal of  (Volume:12 ,  Issue: 4 )

Date of Publication:

Aug. 2003

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.