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Integrated power electronics modules for 400 V/10 A motor-drive applications using flip-chip flex-circuit technology

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6 Author(s)
Xiao, Y. ; Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA ; Shah, H. ; Parrilla, Z. ; Chow, T.P.
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This paper presents the development of an integrated power packaging platform featuring power dies and driver components integration using flex-circuit interconnection and flip-chip soldering technology. The packaging platform that was previously demonstrated suitably for 42 V/16 A automotive applications is extended to 400 V/10 A motor-drive application, with the electrical performance measured at double-pulse and 10% duty-ratio conditions. The switching characteristics of three different IGBT modules implemented with flip-chip dies or discrete commercial packages on flex-circuitry are evaluated.

Published in:

Power Electronics Specialist Conference, 2003. PESC '03. 2003 IEEE 34th Annual  (Volume:1 )

Date of Conference:

15-19 June 2003