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Design optimization methodology for deep-submicrometer CMOS device at low-temperature operation

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4 Author(s)
Kakumu, M. ; Toshiba Corp., Kawasaki, Japan ; Peters, D.W. ; Liu, H.-Y. ; Chiu, K.-Y.

The design optimization for 0.3-μm channel CMOS technology at liquid-nitrogen temperature (77 K) is described. The tradeoff between circuit performance and reliability for deep-submicrometer CMOS devices at low-temperature operation is theoretically and experimentally examined. A simulator, which selects power-supply voltage and process/device parameters for low-temperature operation, has been developed. Based upon the simulated results, design optimization for low-temperature operation has been proposed to determine power-supply voltage and various process and device parameters. The optimized design has been demonstrated on a 0.3-μm CMOS device, by utilizing electron beam (EB) lithography· Excellent device characteristics and a functional ring oscillator circuit have been obtained at 77 K

Published in:
Electron Devices, IEEE Transactions on  (Volume:39 ,  Issue: 2 )

Date of Publication: Feb 1992

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