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3D nonlinear thermal stress analysis of VCSEL (vertical-cavity surface-emitting laser) assemblies with lead-free flip-chip interconnects

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3 Author(s)
Yida Zou ; Cisco Systems ; Lau, J. ; Catnerlo, S.

First Page of the Article

Published in:

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

Date of Conference:

May 27-30, 2003