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Processability and electrical characteristics of glass substrates for RF wafer-level chip-scale packages

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7 Author(s)
Polyakov, A. ; Delft University of Technology ; Mendes, P.M. ; Sinaga, S.M. ; Bartek, M.
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First Page of the Article

Published in:

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

Date of Conference:

May 27-30, 2003