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Gold bump attachment-of MEM sensor die using thermocompression bonding

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2 Author(s)
Marinis, T.F. ; Draper Laboratory ; Soucy, J.W.

First Page of the Article

Published in:
Electronic Components and Technology Conference, 2003. Proceedings. 53rd

Date of Conference: May 27-30, 2003

Page(s):
385 - 391
ISSN :
0569-5503
Print ISBN:
0-7803-7791-5
Digital Object Identifier :
10.1109/ECTC.2003.1216306

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