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The design and fabrication for the thermal chip of a heat exchanger with arrays of temperature sensors and heaters for study of micro-jet impingement cooling heat transfer process is presented. This thermal chip can minimize the heat loss from the system to the ambient and provide a uniform heat flux along the wall, thus local heat transfer processes along the wall can be measured and obtained. The fabrication procedure presented can reach a chip yield of 100%, and every one of the sensors and heaters on the chip is in good operation condition. Therefore, micro-jet impingement cooling experiments can be performed to obtain both the local micro-scale heat transfer Nusselt number and flow structure along the wall. The experimental results indicate that both the micro-scale impinging jet flow structure and the heat transfer process along the wall is significantly different from the case of large-scale jet impingement cooling process.
TRANSDUCERS, Solid-State Sensors, Actuators and Microsystems, 12th International Conference on, 2003 (Volume:1 )
Date of Conference: 8-12 June 2003