Cart (Loading....) | Create Account
Close category search window
 

InTeRail: using existing and extra interconnects to test core-based SOCs

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Kagaris, D. ; Dept. of Electr. & Comput. Eng., Southern Illinois Univ., Carbondale, IL, USA ; Tragoudas, S.

A flexible test access mechanism (TAM) for embedded cores and their interconnects in a System-on Chip (SOC) environment is presented. It targets core testing parallelism and reduced test application time while explicitly taking into consideration area and performance issues. The TAM primarily uses core interconnects but also allows for extra interconnects. The DFT hardware can be implemented either at the SOC or at the core level. It combines features of TAMs that have been designed for low test application time and those for SOC area and performance criteria.

Published in:

On-Line Testing Symposium, 2003. IOLTS 2003. 9th IEEE

Date of Conference:

7-9 July 2003

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.